Representatives For

Texas, Oklahoma, Arkansas, Louisiana, Kansas and Missouri

CPS is the world leader in developing and manufacturing advanced materials solutions and products, particularly combinations of metals and ceramics, to improve performance and reliability of applications in a variety of end markets.

Our primary advanced material solution is metal matrix composites (MMCs), a class of materials which has several superior properties compared to conventional materials, including improved thermal conductivity, thermal expansion matching, higher stiffness and lighter weight.

CPS AlSiC products are used as microprocessor lids, flip chip lids, heat sinks, microwave housings, optoelectronic housings, power substrates, IGBT baseplates and liquid cold plates.  End applications include motion control (controller) power modules, high voltage PFC (power factor correction) front ends,  pin fin coolers for IGBT modules in hybrid electric vehicles, hi-rel DC/DC converters, UPS (uninterruptible power supplies) and many others.

Advantage of Metal Matrix Composites (AlSiC Material)

  • Coefficient of thermal expansion (CTE) compatible with high-powered electronic devices
  • High thermal conductivity, similar to aluminum, copper molybdenum and copper tungsten
  • Lightweight, 1/3 of copper
  • Dimensional stability, strength
  • Reliability

Markets

  • Electric and hybrid electric vehicles
  • High speed electric trains and subways
  • Clean technology energy applications
  • Aerospace and defense, including armor
  • Oil and gas

Applications

  • Power modules (base plates)
  • Motor controllers
  • Flip-chip IC packaging
  • Hermetic packages
  • Structural applications
  • Vehicle armor
  • Fracking spheres

AlSiC Pin Fin Coolers

-Substrate compatible for thermal expansion

  • Reduced thermally induced mechanical stresses
  • Increased thermal cycling capability (tens of thousands more thermal cycles than copper)
  • High thermal conductivity
  • 180 W/mK at 25 degrees Celcius minimum

-Lightweight

  • 1/3 the weight of copper
  • 3 g/cm cubed

-High strength and stiffness

-Custom design capability

-Supports standard solderable plating  schemes and Copper Cold Gas Spray

-Low cost slotted cast hold solutions

Applications

-Hybrid and electric vehicle power module systems

-Traction, industrial drive motor controllers, hybrid electric and electric vehicles, solar power and wind power


AlSiC IBGT Baseplates

-Substrate compatible for thermal expansion

  • Reduced thermally induced mechanical stresses
  • Increased thermal cycling capability (tens of thousands more thermal cycles than copper)
  • High thermal conductivity
  • 180 W/mK at 25 degrees Celcius minimum

-Lightweight

  • 1/3 the weight of copper
  • 3 g/cm cubed

-High strength and stiffness

-Engineered bow profile on one surface

  • Reduce substrate attachment interface thickness
  • Positive interface to cooler plate

-Standard formats and custom sizes

-Supports standard solderable plating schemes and Copper Cold Gas Spray

Applications

High power or high reliability IGBT modcules

Traction, industrial drive motor controllers, hybrid electric and electric vehicles, solar power and wind power.


Conventional & AlSiC Hermetic Packaging

-Glass to metal seals for high reliability microelectronic packaging

  • Military and aerospace applications
  • Hermetic sealed housings
  • Commercial applications

-Housing formats and housing materials

  • All standard and custom housing materials, including our proprietary AlSiC base with 48 alloy frame

-Hermetic seals

  • Thermal expansion matched seal
  • Borosilicate
  • Compression seals
  • Ceramic feedthrus